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Traceable Temperature Calibrations of Radiation Thermometers for Rapid Thermal Processing

Published

Author(s)

Benjamin K. Tsai

Abstract

Lightpipe radiation thermometers (LPRTs) have been successfully calibrated at NIST for rapid thermal processing (RTP) applications using a sodium heat-pipe blackbody (Na-HPBB) between 700 C and 900 C with an uncertainty of about 0.3 C (k = 1) traceable to the International Temperature Scale of 1990 (ITS-90). Using appropriate effective emissivity models, LPRTs have been used to determine the wafer temperature in the NIST RTP Test Bed with an uncertainty of 3.5 C. With the aid of a thin-film thermocouple wafer, the LPRT can measure the wafer temperature in the NIST RTP Test Bed with an uncertainty of 2.1 C. In RTP reactors where optical access is available, spot-type radiation thermometers (STRTs) become an attractive technique for temperature measurement. From 700 C to 900 C, STRTs can be calibrated against the Na-HPBB with an uncertainty of about 1.1 C. Cable-less LPRTs (CLRTs) offer a decisive advantage to greater traceability than traditional LPRTs. Application of CLRTs eliminates 2.0 C or more uncertainty from the calibration scheme. The Na-HPBB source and the calibration procedures and uncertainties will be discussed. Calibrating radiation thermometers using the NIST Na-HPBB offers traceability to the ITS-90, decreases temperature measurement uncertainties, and improves temperature accuracy.
Proceedings Title
International Conference on Advanced Thermal Processing of Semiconductors
Conference Dates
September 23-26, 2003
Conference Title
IEEE International Conference on Advanced Thermal Processing of Semiconductors -- RTP

Keywords

blackbody, cable-less lightpipe radiation thermomet, calibration, lightpipe radiation thermometers, rapid thermal processing, sodium heat-pipe blackbody, spot-type radiation thermometers, traceability, uncertainty

Citation

Tsai, B. (2005), Traceable Temperature Calibrations of Radiation Thermometers for Rapid Thermal Processing, International Conference on Advanced Thermal Processing of Semiconductors (Accessed December 14, 2024)

Issues

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Created November 1, 2005, Updated February 17, 2017