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Time-Dependent Dielectric Breakdown of Intrinsic SiO2 Films Under Dynamic Stress

Published

Author(s)

P Chaparala, John S. Suehle, C. Messick, M. Roush
Proceedings Title
1995 IEEE International Integrated Reliability Workshop Final Report
Conference Dates
October 22-25, 1995
Conference Location
Lake Tahoe, CA, USA

Citation

Chaparala, P. , Suehle, J. , Messick, C. and Roush, M. (1996), Time-Dependent Dielectric Breakdown of Intrinsic SiO<sub>2</sub> Films Under Dynamic Stress, 1995 IEEE International Integrated Reliability Workshop Final Report, Lake Tahoe, CA, USA (Accessed May 24, 2024)

Issues

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Created December 30, 1996, Updated October 12, 2021