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Through-focus Scanning and Scatterfield Optical Methods for Advanced Overlay Target Analysis

Published

Author(s)

Ravikiran Attota, Michael T. Stocker, Richard M. Silver, Nathanael A. Heckert, Hui Zhou, Richard J. Kasica, Lei Chen, Ronald G. Dixson, Ndubuisi G. Orji, Bryan M. Barnes, Peter Lipscomb

Abstract

In this paper we present overlay measurement techniques that use small overlay targets for advanced semiconductor applications. We employ two different optical methods to measure overlay using modified conventional optical microscope platforms. They are scatterfield and through-focus scanning optical microscope (TSOM) imaging methods. In the TSOM method a target is scanned through the focus of an optical microscope, simultaneously acquiring optical images at different focal positions. The TSOM images are constructed using the through-focus optical images. Overlay analysis is then performed using the TSOM images. In the scatterfield method, a small aperture is scanned at the conjugate back focal plane of an optical microscope. This enables angle-resolved scatterometry on a high-magnification optical platform. We also present evaluation of optical constants using the scatterfield method.
Proceedings Title
Proceedings of SPIE, Metrology, Inspection, and Process Control for Microlithography XXIII, John A. Allgair, Editor
Volume
33
Issue
17
Conference Dates
February 23-27, 2009
Conference Location
San Jose, CA

Keywords

Overlay, Scatterfield, Scatterometry, TSOM, In-chip, Through-focus, Optical constants
Created September 1, 2008, Updated February 19, 2017