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Thickness and Composition Reference Standards for Semiconductor Metrology



Donald Windover, Victor H. Vartanian, Tom Kelly, Tom Larson, David L. Gil


This report from the MET16 project describes tests of X-ray reflectometry (XRR), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and atom probe tomography (APT) for thickness and compositional reference metrology.
SEMATECH Technology Transfer #11035149A-TR


Measuring Instruments, Spectroscopy, Standard Artifacts, Standard Reference Material, Thin Film Thickness, X-ray Diffraction, X-ray Reflectometry


Windover, D. , Vartanian, V. , Kelly, T. , Larson, T. and Gil, D. (2011), Thickness and Composition Reference Standards for Semiconductor Metrology, SEMATECH Technology Transfer #11035149A-TR (Accessed June 14, 2024)


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Created July 22, 2011, Updated January 20, 2023