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Thickness and Composition Reference Standards for Semiconductor Metrology

Published

Author(s)

Donald Windover, Victor H. Vartanian, Tom Kelly, Tom Larson, David L. Gil

Abstract

This report from the MET16 project describes tests of X-ray reflectometry (XRR), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and atom probe tomography (APT) for thickness and compositional reference metrology.
Citation
SEMATECH Technology Transfer #11035149A-TR

Keywords

Measuring Instruments, Spectroscopy, Standard Artifacts, Standard Reference Material, Thin Film Thickness, X-ray Diffraction, X-ray Reflectometry

Citation

Windover, D. , Vartanian, V. , Kelly, T. , Larson, T. and Gil, D. (2011), Thickness and Composition Reference Standards for Semiconductor Metrology, SEMATECH Technology Transfer #11035149A-TR (Accessed June 14, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created July 22, 2011, Updated January 20, 2023