Rice, J.
, Rudman, D.
, Bang, C.
, Flik, M.
and Schmidt, M.
(1993),
Thermal Isolation of High-Temperature Superconducting Thin Films Using Silicon Wafer Bonding and Micromachining, Journal of Microelectromechanical Systems
(Accessed March 13, 2025)
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Thermal Isolation of High-Temperature Superconducting Thin Films Using Silicon Wafer Bonding and Micromachining
Published
Author(s)
, , C. A. Bang, M. I. Flik, M. A. Schmidt
Citation
Journal of Microelectromechanical Systems
Volume
2
Issue
4
Pub Type
Journals
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created November 30, 1993, Updated October 12, 2021