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Thermal Isolation of High-Temperature Superconducting Thin Films Using Silicon Wafer Bonding and Micromachining

Published

Author(s)

Joseph P. Rice, David A. Rudman, C. A. Bang, M. I. Flik, M. A. Schmidt
Citation
Journal of Microelectromechanical Systems
Volume
2
Issue
4

Citation

Rice, J. , Rudman, D. , Bang, C. , Flik, M. and Schmidt, M. (1993), Thermal Isolation of High-Temperature Superconducting Thin Films Using Silicon Wafer Bonding and Micromachining, Journal of Microelectromechanical Systems (Accessed February 25, 2024)
Created November 30, 1993, Updated October 12, 2021