Suehle, J.
and Schafft, H.
(1992),
Techniques and Characterization of Pulsed Electromigration at the Wafer Level, Microelectronics Reliability
(Accessed May 9, 2025)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Techniques and Characterization of Pulsed Electromigration at the Wafer Level
Published
Author(s)
,
Citation
Microelectronics Reliability
Volume
32
Issue
11
Pub Type
Journals
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created October 31, 1992, Updated October 12, 2021