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Techniques and Characterization of Pulsed Electromigration at the Wafer Level

Published

Author(s)

John S. Suehle, Harry A. Schafft
Citation
Microelectronics Reliability
Volume
32
Issue
11

Citation

Suehle, J. and Schafft, H. (1992), Techniques and Characterization of Pulsed Electromigration at the Wafer Level, Microelectronics Reliability (Accessed May 25, 2024)

Issues

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Created October 31, 1992, Updated October 12, 2021