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Techniques and Characterization of Pulsed Electromigration at the Wafer Level

Published

Author(s)

John S. Suehle, Harry A. Schafft
Proceedings Title
Proc., RELECTRONIC '92
Conference Dates
August 26-30, 1991
Conference Location
Budapest, 1, HU

Citation

Suehle, J. and Schafft, H. (1992), Techniques and Characterization of Pulsed Electromigration at the Wafer Level, Proc., RELECTRONIC '92, Budapest, 1, HU (Accessed May 25, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created December 30, 1992, Updated October 12, 2021