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Superconducting X-ray Sensors for Tomography of Microelectronics

Published

Author(s)

Joseph Fowler, Zachary H. Levine, Paul Szypryt, Daniel Swetz

Abstract

Tomographic imaging of integrated circuits at scales smaller than 1 micrometer is a challenging x-ray measurement. We describe a research instrument based upon superconducting x-ray microcalorimeters, which help to discriminate among materials in a sample and discriminate signal photons from background. The instrument recently demonstrated a 3D image that resolves wiring 160 nm wide, and finds all circuit features in the appropriate region of the circuit design.
Citation
Electronic Device Failure Analysis
Volume
25
Issue
4

Citation

Fowler, J. , Levine, Z. , Szypryt, P. and Swetz, D. (2023), Superconducting X-ray Sensors for Tomography of Microelectronics, Electronic Device Failure Analysis, [online], https://doi.org/10.31399/asm.edfa.2023-4.p004, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=936684 (Accessed April 15, 2024)
Created November 1, 2023, Updated March 29, 2024