Fowler, J.
, Levine, Z.
, Szypryt, P.
and Swetz, D.
(2023),
Superconducting X-ray Sensors for Tomography of Microelectronics, Electronic Device Failure Analysis, [online], https://doi.org/10.31399/asm.edfa.2023-4.p004, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=936684
(Accessed April 29, 2024)
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Superconducting X-ray Sensors for Tomography of Microelectronics
Published
Author(s)
, , ,
Abstract
Tomographic imaging of integrated circuits at scales smaller than 1 micrometer is a challenging x-ray measurement. We describe a research instrument based upon superconducting x-ray microcalorimeters, which help to discriminate among materials in a sample and discriminate signal photons from background. The instrument recently demonstrated a 3D image that resolves wiring 160 nm wide, and finds all circuit features in the appropriate region of the circuit design.Citation
Electronic Device Failure Analysis
Volume
25
Issue
4
Pub Type
Journals
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Citation
Created November 1, 2023, Updated March 29, 2024