In Situ Stress Measurements During Aluminum Deposition From AlCl(subscript 3)-EtMeImCl

Published

October 1, 2006

Author(s)

Gery R. Stafford, O Kongstein, G Haarberg

Abstract

In situ stress measurements were made during aluminum electrodeposition from AlCl(subscript 3)-EtMeImCl using the waver curvature method. The upd of Al on (111)-textured Cu shows a stress response that is consistent with a two-step process where the first step involves the desorption of AlCl(subscript 4) from the Cu surface. This results in a tensile surface stress as expected from adsorbate induced surface stresses. The tensile stress is eliminated when the full incommensurate monolayer of aluminum is formed. On (111)-textured Au, an anion desorption signature is not observed, possibly due to the positive pzc for Au in this electrolyte. The full Al monolayer results in a tensile stress that can be attributed to both lattice misfit and Al-Au alloying. The bulk deposition of Al on (111)-textured Au appears to be governed by Stranski-Krastanov three-dimensional growth. Initially a compressive stress is observed that we attribute to capillarity. This is followed by a rapid increase in tensile stress that is consistent with nuclei coalescence and grain boundary formation. In this region of nucleation and growth, the total stress is the superposition of both stress mechanisms and each is dependent on the deposition potential.

Citation

Journal of the Electrochemical Society

Volume

153

Issue

4

Pub Type

Journals

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Keywords

Cu electrodeposition, grain boundary formation, in situ stress measurements, nuclei coalescence, surface stress, underpotential deposition, wafer curvature

Citation

Stafford, G. , Kongstein, O. and Haarberg, G. (2006), In Situ Stress Measurements During Aluminum Deposition From AlCl(subscript 3)-EtMeImCl, Journal of the Electrochemical Society, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853371 (Accessed April 29, 2024)