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In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper.

Published

Author(s)

Di XU, Vinay Sriram, Vidvuds Ozolins, Jenn-Ming Yang, K. N. Tu, Gery R. Stafford, Carlos R. Beauchamp

Abstract

In-situ stress measurements were performed during high frequency pulse electrodeposition of nanotwinned Cu thin films. Periodic stress changes during pulse on and off periods were observed. The stress profile showed an abrupt increase of tensile stress to about 400 MPa during the pulse-on period and a stress relaxation during the pulse-off period. First principles calculations predict that a complete relaxation of the tensile stress allows the formation of nanotwins separated by 29 nm or more. This is in good agreement with the results obtained from microstructural analysis of the Cu films fabricated during in situ stress measurements.
Citation
Journal of Applied Physics
Volume
105
Issue
2

Citation

XU, D. , Sriram, V. , Ozolins, V. , Yang, J. , Tu, K. , Stafford, G. and Beauchamp, C. (2009), In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper., Journal of Applied Physics, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=900134 (Accessed July 25, 2024)

Issues

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Created September 30, 2009, Updated October 12, 2021