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Search Publications by: Andrew Korovich (Fed)

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Displaying 1 - 3 of 3

A Switchable Longitudinal & Shear BLS Microscope for Comprehensive Modulus Imaging of Semiconductor Packaging Materials

June 17, 2026
Author(s)
Andrew Gayle, Sebastian Engmann, Ran Tao, Andrew Korovich, Polette Centellas, Yvonne Gerbig, Christopher Soles, Chris Michaels
Brillouin light scattering (BLS) offers an optical, noncontact, nondestructive method for probing the mechanical properties of next-generation semiconductor packaging materials. In this work, a switchable BLS microscope with both backscattered and off-axis

Controlling the Reaction Pathway to Tune Packaging Epoxy Properties

May 26, 2026
Author(s)
Polette Centellas, Ran Tao, Andrew Korovich, Alexander Landauer, Amanda Forster, Siena Iavarone-Garza, Dante Ribeiro, Huong Giang Nguyen, Jan Obrzut, Stian Romberg, Christopher Soles
Semiconductor packaging demands materials with precisely tuned properties. We demonstrate that the thermoset processing pathway strongly influences functional properties, including moisture and thermomechanical responses. Using a model epoxy system, our
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