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Search Publications by George D. Quinn

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Displaying 1 - 25 of 62

A Standard Method for Measuring Wafer Bond Strength for MEMS Applications

Richard A. Allen, Janet M. Cassard, Winthrop A. Baylies, David T. Read, George D. Quinn, Frank W. DelRio, Kevin T. Turner, Michael Bernasch, Joerg Bagdahn
A round robin, to provide precision and bias data for SEMI standard MS5-1107, Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test

On the Vickers Indentation Fracture Toughness Test

George D. Quinn, Richard Bradt
The Vickers indentation fracture toughness test or VIF is addressed by considering its origins and the numerous nist-equations that have been applied along with

Fracture Strength of Silicon Carbide Microspecimens

W N. Sharpe, O Jadaan, G M. Beheim, George D. Quinn, N N. Nemeth
Micro silicon carbide tension specimen were prepared with straight, curved, and notched gage lengths. These were tested to failure and the strengths analyzed by

Machining Cracks in Finished Ceramics

George D. Quinn, L K. Ives, S Jahanmir
Well prepared strength test specimens and components break from a material s inherent flaws and machining damage has no effect on strength. On the other hand