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Displaying 1926 - 1950 of 2755

Scanning electron microscope dimensional metrology using a model-based library

November 1, 2005
Author(s)
John S. Villarrubia, Andras Vladar, Michael T. Postek
The semiconductor electronics industry places significant demands upon secondary electron imaging to obtain dimensional measurements that are used for process control or failure analysis. Tolerances for measurement uncertainty and repeatability are smaller

A Benefit/Cost Model for Metrology in Manufacturing

October 24, 2005
Author(s)
James E. Potzick
Every measurement of a feature's size or placement on a wafer or photomask is made for a reason. Usually a measurement leads to a decision, often involving a process adjustment or business transaction, and there are costs and benefits attached to these

The Study of Silicon Stepped Surfaces as Atomic Force Microscope Calib Standards With a Calibrated AFM at NIST

September 29, 2005
Author(s)
V W. Tsai, Theodore V. Vorburger, Ronald G. Dixson, Joseph Fu, R Koning, Richard M. Silver, Edwin R. Williams
Due to the limitations of modern manufacturing technology, there is no commercial height artifact at the sub-nanometer scale currently available. The single-atom steps on a cleaned silicon (111) surface with a height of 0.314 nm, derived from the lattice

Nanometer Resolution Metrology with the NIST Molecular Measuring Machine

September 23, 2005
Author(s)
John A. Kramar
Nanometre accuracy and resolution metrology over technically relevant areas is becoming a necessity for the progress of nanomanufacturing. At the National Institute of Standards and Technology, we are developing the Molecular Measuring Machine, a scanned

A Modular System Architecture for Agile Assembly of Nanocomponents using Optical Tweezers

September 10, 2005
Author(s)
Arvind K. Balijepalli, Thomas W. LeBrun, Cedric V. Gagnon, Yong-Gu Lee, Nicholas G. Dagalakis
In order to realize the flexibility optical trapping offers as a nanoassembly tool, we need to develop natural and intuitiveinterfaces to assemble large quantities of nanocomponents quickly and cheaply. We propose a system to create such aninterface that

Issues in Line Edge and Linewidth Roughness Metrology

September 9, 2005
Author(s)
John S. Villarrubia
In semiconductor electronics applications, line edge and linewidth roughness are generally measured using a root mean square (RMS) metric. The true value of RMS roughness depends upon the length of edge or line that is measured and the chosen sampling

Characterization of Optical Traps Using On-Line Estimation Methods

August 26, 2005
Author(s)
Jason J. Gorman, Thomas W. LeBrun, et al
System identification methods are presented for the estimation of the characteristic frequency of an optically trapped particle. These methods are more amenable to automated on-line measurements and are believed to be less prone to erroneous results

A Fiber Probe for CMM Measurements of Small Features

August 1, 2005
Author(s)
Jack A. Stone Jr., Balasubramanian Muralikrishnan, John R. Stoup
We report on performance of a new form of fiber probe, which can be used in conjunction with a coordinate measuring machine (CMM) for microfeature measurement. The probe stylus is a glass fiber with a small ball (?75 ?m diameter) glued to the end. When the

Consumer Package Labeling Guide: Labeling by Weight

August 1, 2005
Author(s)
K M. Dresser
[Withdrawn (February 13, 2018)] Guide is intended to provide manufacturers, packers, distributors, and retailers of packaged products with information about the labeling requirements for commodities that are sold by weight in the consumer marketplace. The

Consumer Packaging Labeling Guide: Selling by Volume

August 1, 2005
Author(s)
K M. Dresser
[Withdrawn (February 13, 2018)] Guide is intended to provide manufacturers, packers, distributors, and retailers of packaged products with information about the labeling requirements for commodities that are sold by volume in the consumer marketplace. The

A Simulation Study of Repeatability and Bias in the CD-SEM

July 1, 2005
Author(s)
John S. Villarrubia, Andras Vladar, Michael T. Postek
Abstract: The ability of a critical dimension scanning electron microscope (CD-SEM) to resolve differences in the widths of two lines depends on the instrument?s measurement repeatability and any sample dependent biases. The dependence of repeatability and

Development of Multiple Beam Optical Tweezers

June 1, 2005
Author(s)
Dongjin Lee, Thomas W. LeBrun, Arvind Balijepalli, Jason J. Gorman, Cedric V. Gagnon, Daehie Hong, Esther H. Chang
This paper presents the design of a multiple beam optical tweezers instrument used for manipulating micro/nano-sized components. The basic equations used in designing the optical tweezers are derived and the stable and time-sharing multiple beam optical

High-resolution Optical Metrology

May 1, 2005
Author(s)
Richard M. Silver, Ravikiran Attota, Michael T. Stocker, M R. Bishop, Lowell P. Howard, Thomas A. Germer, Egon Marx, M P. Davidson, Robert D. Larrabee
Recent advances in optical imaging techniques have unveiled new possibilities for optical metrology and optical-based process control measurements of features in the 65 nm node and beyond. In this paper we discuss methods and applications that combine
Displaying 1926 - 1950 of 2755
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