January 1, 2001
Author(s)
S Y. Yang, C S. Pai, O Nalamasu, E Reichmanis, P Mirau, Yaw S. Obeng, J Seputro, Eric K. Lin, V. J. Lee
A new class of organosilicate has been developed that can attain an ultra low-dielectric constant, k of less than 2.0, with high dielectric breakdown strength (> 2 MV/cm). In this approach, a series of triblock polymers, poly(ethylene oxide-b-propylene