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Xing Chen, Wei Yu, David W. Griffith, Nada T. Golmie, Guobin Xu, Chao Lu
Recently, there are growing concerns about smart grid security and resilience. The performance of smart grid may suffer from component failures or targeted attacks. A sophisticated adversary may target critical components in a smart grid, leading to
Wei Yu, David W. Griffith, Linqiang Ge, Sulabh Bhattarai, Nada T. Golmie
The smart grid is a new type of power grid that will use the advanced communication network technologies to support more efficient energy transmission and distribution. The grid infrastructure was designed for reliability; but security, especially against
Most types of refrigerating appliances are rated according to an established test procedure and their energy use is regulated by the US Department of energy. These products are generally built around a vapor compression system that is used to maintain a
Lee J. Gorny, Keith A. Gillis, Michael R. Moldover
As a part of NISTs program to standardize measurements of greenhouse gas emissions, we are developing long-wavelength acoustic flowmeter (LWAF) for accurate, economical measurement of flue gas flows, for example, from coal-burning power plants. A LWAF is
Christophe Martinsons, Yuqin Zong, C Cameron Miller, Yoshi Ohno
Specific issues appear in the measurement of the electrical power of AC-powered LED lamps and luminaires because they often generate harmonic currents in a wide frequency range. The topic of this paper is to clarify the impact of these harmonic currents on
As the electric power grid is changing to a smarter more dynamically controlled system, there is increasing need for measurements that show the global status of the system for wide-area monitoring and control. These measurements require time
Karl Hobart, Eugene Imhoff, F. J. Kub, Allen R. Hefner Jr., Tam H. Duong, Jose M. Ortiz, Sei-Hyung Ryu, David Grider, Scott G. Leslie, Jerry Sherbondy, B Ray
Transient liquid phase (TLP) bonding is an advanced die-attach technique for wide-bandgap power semiconductor and high-temperature packaging. TLP bonding advances current soldering techniques by raising the melting point to over 500 °C without detrimental
The National Institute of Standards and Technology (NIST) has efforts underway to accelerate the international development of interoperability standards to support the future modernized Smart Grid electric grid or energy delivery network characterized by
SangHyun S. Lim, Thomas M. Wallis, Atif A. Imtiaz, Dazhen Gu, Pavel Kabos, Pavol Krivosik
We compared three electrical detection techniques; differential resistance (dV/dI), RF/microwave transmission, and spin rectification measurements for magnetization dynamics in individual patterned sub-micron structures. Different electrical techniques