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Scanning Acoustic Microscopy Stress Measurements in Electronic Packaging

Published

Author(s)

E Drescher-Krasicka, T M. Moore, T Hartfield, D Chery

Abstract

Scanning acoustic microscopy has been successfully implemented for the nondestructive detection of cracks and delaminations in integrated circuit packages. In reliability tests of molded surface mount components, acoustic microscopy was instrumental in identifying delamination at the mold compound/die interface as the primary cause of electrical failure during temperature cycling. The ability of the acoustic microscope to nondestructively image stress distributions prior to failure would greatly extend the impact of scanning acoustic microscopy for new package development and process control. This may be particularly important for the packaging of devices with fragile low-k (dielectric constant) layers in the device structure. Possible approaches for imaging stress fields in IC packages are discussed.
Conference Dates
March 23-27, 1998
Conference Location
Undefined
Conference Title
International Conference on Characterization and Metrology for ULSI Technology

Keywords

IC packages, imaging stress, scanning acoustic microscopy, stress distributions

Citation

Drescher-Krasicka, E. , Moore, T. , Hartfield, T. and Chery, D. (2008), Scanning Acoustic Microscopy Stress Measurements in Electronic Packaging, International Conference on Characterization and Metrology for ULSI Technology, Undefined (Accessed April 17, 2024)
Created October 16, 2008