Drexler, E.
(1999),
Reliability of a Flip-Chip Package Thermally Loaded Between -55 and 125 C, Journal of Electronic Materials
(Accessed December 9, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Reliability of a Flip-Chip Package Thermally Loaded Between -55 and 125 C
Published
Author(s)
Abstract
The low-temperature reliability of flip-chip-on-board (FCOB) packages has been a source of concern for manufacturers of the innovative package.Citation
Journal of Electronic Materials
Volume
28
Issue
No. 11
Pub Type
Journals
Keywords
electron-beam moire, flip-chip, flip-chip-on-board, moire, out-of-plane displacements, solder mask, solderball fatigue, thermal load
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created May 1, 1999, Updated February 17, 2017