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PUBLICATIONS

Reliability of a Flip-Chip Package Thermally Loaded Between -55 and 125 C

Published

Author(s)

Elizabeth S. Drexler

Abstract

The low-temperature reliability of flip-chip-on-board (FCOB) packages has been a source of concern for manufacturers of the innovative package.
Citation
Journal of Electronic Materials
Volume
28
Issue
No. 11
Pub Type
Journals

Keywords

electron-beam moire, flip-chip, flip-chip-on-board, moire, out-of-plane displacements, solder mask, solderball fatigue, thermal load

Citation

Drexler, E. (1999), Reliability of a Flip-Chip Package Thermally Loaded Between -55 and 125 C, Journal of Electronic Materials (Accessed October 26, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created May 1, 1999, Updated February 17, 2017
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