Predicting strength distributions of MEMS structures using flaw size and spatial density

Published

November 4, 2019

Author(s)

Robert F. Cook, Frank W. DelRio, Brad L. Boyce

Abstract

The populations of flaws in individual layers of microelectromechanical systems (MEMS) structures are determined and verified using a combination of specialized specimen geometry, recent probabilistic analysis, and topographic mapping. Strength distributions of notched and tensile bar specimens are analyzed assuming a single flaw population set by fabrication and common to both specimen geometries. Both the average spatial density of flaws and the flaw size distribution are determined and used to generate quantitative visualizations of specimens. Scanning probe-based topographic measurements are used to verify the flaw spacings determined from strength tests and support the idea that grain boundary grooves on sidewalls control MEMS failure. The findings here suggest that strength controlling features in MEMS devices increase in separation, i.e., become less spatially dense, and decrease in size, i.e., become less potent flaws, as processing proceeds up through the layer stack. The method demonstrated for flaw population determination is directly applicable to strength prediction for MEMS reliability and design.

Citation

Microsystems & Nanoengineering

Volume

5

Pub Type

Journals

Download Paper

https://doi.org/10.1038/s41378-019-0093-y

Local Download

Keywords

strength, flaw, topography, probability

Citation

Cook, R. , DelRio, F. and Boyce, B. (2019), Predicting strength distributions of MEMS structures using flaw size and spatial density, Microsystems & Nanoengineering, [online], https://doi.org/10.1038/s41378-019-0093-y (Accessed April 18, 2024)