Germer, T.
and Sung, L.
(1999),
Polarized Light Scattering Measurements of Roughness, Subsurface Defects, Particles, and Dielectric Layers on Silcon Wafers, Conference on Electromagnetic and Light Scattering by Nonspherical Particles: Theory and Application
(Accessed December 14, 2024)
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Polarized Light Scattering Measurements of Roughness, Subsurface Defects, Particles, and Dielectric Layers on Silcon Wafers
Published
Author(s)
,
Abstract
This article outlines theoretical and experimental results for polarized light scattering from five different sample configurations: surface roughness of a single interface, defects below a single interface, spherical particles above a single surface, spherical particles above a dielectric film, and roughness of the top interface of a dielectric film. These measurements demonstrate that po-larized light scattering can be used to characterized defects on surfaces, pro-vided sufficient information is available about the system without defects. It is found that measurement of the principal direction of the polarization for p-polarized incident light, h(p), when measured out of the plane of incidence, can be used to distinguish amongst light scattered by micro roughness, subsurface defects, and particulate contaminantsCitation
Conference on Electromagnetic and Light Scattering by Nonspherical Particles: Theory and Application
Volume
4
Pub Type
Journals
Keywords
dielectric films, microroughness, particles, polarimetry, scatter, subsurface, surface
Citation
Issues
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Created July 1, 1999, Updated February 17, 2017