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Operando Scanning Electron and Microwave Microscopies in Plasmas: A Comparative Analysis

Published

Author(s)

Andrei A. Kolmakov, Alexander Tselev

Abstract

There exists a great need for an operando nanoscale characterization of evolution of surface composition and morphology during plasma-assisted processing. This includes sputter deposition, plasma-assisted etching, plasma-enhanced atomic layer deposition and other processes relevant for semiconductor and aerospace industries, environmental remediation, and biomedical technology. Recently, we proposed near-field scanning-probe-based microwave imaging as a tool to image surfaces immediately (a few seconds) after plasma processing with a sub-100 nm spatial resolution. In this communication, we report on true operando near-field microwave imaging in plasma and its extension to imaging in SEM.
Proceedings Title
Microscopy and Microanalysis
Volume
26
Issue
S2
Conference Dates
August 2-6, 2020
Conference Location
Milwaukee, WI
Conference Title
Microscopy and Microanalysis 2020

Keywords

Operando SEM, microwave microscopy, plasma environment

Citation

Kolmakov, A. and Tselev, A. (2020), Operando Scanning Electron and Microwave Microscopies in Plasmas: A Comparative Analysis, Microscopy and Microanalysis, Milwaukee, WI, [online], https://doi.org/10.1017/S1431927620021790 (Accessed October 8, 2024)

Issues

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Created July 29, 2020, Updated December 2, 2020