Skip to main content

NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

A Novel Multilayer Circuit Process Using YBa2Cu3Ox/SrTiO3 Thin Films Patterned by Wet Etching and Ion Milling

Published

Author(s)

H. Q. Li, Ronald H. Ono, Leila R. Vale, David A. Rudman, Sy-Hwang Liou
Citation
Applied Physics Letters
Volume
69
Issue
18

Citation

Li, H. , Ono, R. , Vale, L. , Rudman, D. and Liou, S. (1996), A Novel Multilayer Circuit Process Using YBa<sub>2</sub>Cu<sub>3</sub>O<sub>x</sub>/SrTiO<sub>3</sub> Thin Films Patterned by Wet Etching and Ion Milling, Applied Physics Letters (Accessed November 7, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created September 30, 1996, Updated October 12, 2021
Was this page helpful?