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A New Fabrication Process for Planar Thin-Film Multijunction Thermal Converters

Published

Author(s)

Thomas F. Wunsch, Joseph R. Kinard Jr., Ronald R. Manginell, O. M. Solomon, Thomas E. Lipe Jr.

Abstract

Advanced thin flm processing and packaging technologies are employed in the fabrication of new planar thin-film multijunction thermal converters. The processing packaging, and design features build on experience gained from prior NIST demonstrations of thin-film converters with optimizations for improved sensitivity, bandwidth, manufacturability, and reliability.
Proceedings Title
Proc., Conference on Precision Electromagnetic Measurements (CPEM)
Conference Dates
May 14-19, 2000
Conference Location
Sydney, 1, AS

Keywords

ac-dc difference, Bosch etching, multijunction converter, planar converter, thermal converter, thin-film converter, vacuum packaging

Citation

Wunsch, T. , Kinard Jr., J. , Manginell, R. , Solomon, O. and Lipe Jr., T. (2000), A New Fabrication Process for Planar Thin-Film Multijunction Thermal Converters, Proc., Conference on Precision Electromagnetic Measurements (CPEM), Sydney, 1, AS, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=3614 (Accessed April 13, 2024)
Created April 30, 2000, Updated October 12, 2021