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Neutron Reflectivity for Interfacial Materials Characterization
Published
Author(s)
Eric K. Lin, D J. Pochan, R Kolb, Wen-Li Wu, Sushil K. Satija
Abstract
Measurements of the physical properties of materials, such as the coefficient of thermal expansion (CTE), in thin films and at interfaces are very important in microelectronics packaging and interconnection, especially as electronic devices decrease in size and interfaces become a larger proportion of the device. Neutron reflectometry is a powerful experimental tool for the measurement of interfacial properties (1). Neutron reflectometry is a non-destructive measurement technique able to measure interfacial profiles and thin film thicknesses with very high resolution ([approximately]0.1 nm). The use of neutrons provides a unique capability of selectively labeling a material component by deuteration. Thus, high contrast to neutrons can be generated between almost chemically identical species. With the increase in organic material components in electronic packaging and interlayer dielectrics, neutron reflectometry with selective deuteration is an ideal technique to study the properties of these materials at the interfaces.To demonstrate the advantages of using neutron reflectometry, we present two examples of how neutron reflectometry can be used to study important issues in electronics packaging: a) the measurement of the mobility of polymer chains near a solid substrate and b) the measurement of the thermal expansion of confined polymer films.
Citation
International Conference on Characterization and Metrology for ULSI Technology
Lin, E.
, Pochan, D.
, Kolb, R.
, Wu, W.
and Satija, S.
(2008),
Neutron Reflectivity for Interfacial Materials Characterization, International Conference on Characterization and Metrology for ULSI Technology
(Accessed October 1, 2025)