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PUBLICATIONS

NEMI's Lead-Free Alloy

Published

Author(s)

A -. Rae, C A. Handwerker

Abstract

Invited article in Circuits Assembly magazine that discusses how the NEMI Project's extensive characterization of the NEMI Sn-Ag-Cu alloy applies to other commercial Sn-Ag-Cu alloys being used in other parts of the world.
Citation
Circuits Assembly
Volume
15
Issue
No. 4
Pub Type
Journals

Keywords

circuit board assembly, environmental issues, lead, lead-free alloys, microelectronics, NEMI, solder alloys

Citation

Rae, A. and Handwerker, C. (2004), NEMI's Lead-Free Alloy, Circuits Assembly (Accessed October 8, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created March 31, 2004, Updated October 12, 2021
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