Rae, A.
and Handwerker, C.
(2004),
NEMI's Lead-Free Alloy, Circuits Assembly
(Accessed June 23, 2025)
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NEMI's Lead-Free Alloy
Published
Author(s)
A -. Rae,
Abstract
Invited article in Circuits Assembly magazine that discusses how the NEMI Project's extensive characterization of the NEMI Sn-Ag-Cu alloy applies to other commercial Sn-Ag-Cu alloys being used in other parts of the world.Citation
Circuits Assembly
Volume
15
Issue
No. 4
Pub Type
Journals
Keywords
circuit board assembly, environmental issues, lead, lead-free alloys, microelectronics, NEMI, solder alloys
Citation
Issues
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Created March 31, 2004, Updated October 12, 2021