NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

PUBLICATIONS

Modeling of Solvent Evaporation Effects for Hot Plate Baking of Photoresist

Published

Author(s)

C A. Mach, D P. DeWitt, Benjamin K. Tsai, G Yetter
Citation
SPIE
Volume
2195
Pub Type
Journals

Citation

Mach, C. , DeWitt, D. , Tsai, B. and Yetter, G. (1994), Modeling of Solvent Evaporation Effects for Hot Plate Baking of Photoresist, SPIE (Accessed October 10, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created December 31, 1993, Updated October 12, 2021
Was this page helpful?