Josell, D.
, Wallace, W.
, Warren, J.
, Wheeler, D.
and Powell, A.
(2002),
Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves, Journal of Electronic Packaging, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853827
(Accessed April 18, 2024)
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Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves
Published
Author(s)
, , , , Aadam C. Powell
Citation
Journal of Electronic Packaging
Volume
124(3)
Pub Type
Journals
Download Paper
Keywords
Electronic Materials, Simulations & Modeling, Surface-Evolver, Thermal Properties, alignment, flip-chip, solder, solderjoint, wetting
Citation
Created December 31, 2001, Updated October 12, 2021