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Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves

Published

Author(s)

Daniel Josell, William E. Wallace, James A. Warren, Daniel Wheeler, Aadam C. Powell
Citation
Journal of Electronic Packaging
Volume
124(3)

Keywords

Electronic Materials, Simulations & Modeling, Surface-Evolver, Thermal Properties, alignment, flip-chip, solder, solderjoint, wetting

Citation

Josell, D. , Wallace, W. , Warren, J. , Wheeler, D. and Powell, A. (2002), Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves, Journal of Electronic Packaging, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853827 (Accessed July 15, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created December 31, 2001, Updated October 12, 2021