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PUBLICATIONS

Mechanical Deformation in Conductive Adhesives as Measured with Electron-Beam Moire

Published

Author(s)

Elizabeth S. Drexler, J R. Berger

Abstract

Two forms (paste and film) of isotropically conductive adhesives (Cas) were mechanically loaded in shear mode.
Citation
Journal of Electronic Packaging
Volume
121
Pub Type
Journals

Keywords

CA, conductive adhesive, electron-beam moire, ICA, moire, shear strength

Citation

Drexler, E. and Berger, J. (1999), Mechanical Deformation in Conductive Adhesives as Measured with Electron-Beam Moire, Journal of Electronic Packaging (Accessed October 15, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created June 1, 1999, Updated February 17, 2017
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