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Mechanical Deformation in Conductive Adhesives as Measured with Electron-Beam Moire

Published

Author(s)

Elizabeth S. Drexler, J R. Berger

Abstract

Two forms (paste and film) of isotropically conductive adhesives (Cas) were mechanically loaded in shear mode.
Citation
Journal of Electronic Packaging
Volume
121

Keywords

CA, conductive adhesive, electron-beam moire, ICA, moire, shear strength

Citation

Drexler, E. and Berger, J. (1999), Mechanical Deformation in Conductive Adhesives as Measured with Electron-Beam Moire, Journal of Electronic Packaging (Accessed March 3, 2024)
Created June 1, 1999, Updated February 17, 2017