Drexler, E.
and Berger, J.
(1999),
Mechanical Deformation in Conductive Adhesives as Measured with Electron-Beam Moire, Journal of Electronic Packaging
(Accessed May 17, 2025)
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Mechanical Deformation in Conductive Adhesives as Measured with Electron-Beam Moire
Published
Author(s)
,
Abstract
Two forms (paste and film) of isotropically conductive adhesives (Cas) were mechanically loaded in shear mode.Citation
Journal of Electronic Packaging
Volume
121
Pub Type
Journals
Keywords
CA, conductive adhesive, electron-beam moire, ICA, moire, shear strength
Citation
Issues
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Created June 1, 1999, Updated February 17, 2017