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MEASUREMENTS FOR MECHANICAL RELIABILITY OF THIN FILMS

Published

Author(s)

David T. Read, Alex Volinsky

Abstract

This paper reviews techniques for measurement of basic mechanical properties of thin films. Emphasis is placed on the adaptations needed to prepare, handle, and characterize thin films, and on adaptations of fracture mechanics for adhesion strength. The paper also describes a recent development, the use of electrical current as a controlled means of applying thermomechanical stresses to electrical conductors and its use in characterizing reliability.
Proceedings Title
Proceedings of NATO Advanced Research Workshop on Security and Reliability of Damaged Structures and Defective Materials
Conference Dates
October 19-22, 2008
Conference Location
Portoroz, SI
Conference Title
Security and Reliability of Damaged Structures and Defective Materials

Keywords

delamination, grain, size, strain, strength, substrate, testing, tensile, yield strength, Young's modulus

Citation

Read, D. and Volinsky, A. (2009), MEASUREMENTS FOR MECHANICAL RELIABILITY OF THIN FILMS, Proceedings of NATO Advanced Research Workshop on Security and Reliability of Damaged Structures and Defective Materials , Portoroz, SI, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=854473 (Accessed April 15, 2024)
Created September 23, 2009, Updated February 19, 2017