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Lead-free Solder Alloys: NEMI Recommendation



E -. Bradley, C A. Handwerker, J -. Sohn


There has been substantial discussion worldwide in the electronics assembly community regarding the ideal composition for the primary lead-free alloy for use as a replacement for eutectic Sn-Pb in electronics assembly. Over the last two years, a consensus has developed that the general-purpose lead-free alloy should be from the Sn-Ag-Cu family. This article will go into some of the reasons for the NEMI alloy choice and the variations of the system relative to melting point and fraction of melted material. Microstructure and reliability results are also discussed.
Circuits Assembly


circuit boards, electronics assembly, lead-free, solder


Bradley, E. , Handwerker, C. and Sohn, J. (2021), Lead-free Solder Alloys: NEMI Recommendation, Circuits Assembly (Accessed February 27, 2024)
Created October 12, 2021