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Influence of Interfacial Chemistry and Molecular Length on the Electronic Properties of Metal-Molecule-Silicon Junctions Produced by Flip Chip Lamination  

Published

Author(s)

Michael A. Walsh, Mariona Coll, Benjamin Jones, Curt A. Richter, Christina A. Hacker
Proceedings Title
International Semiconductor Device Research Symposium
 
Conference Dates
December 7-9, 2011
Conference Location
College Park, MD
Conference Title
International Semiconductor Device Research Symposium

Citation

Walsh, M. , Coll, M. , Jones, B. , Richter, C. and Hacker, C. (2011), Influence of Interfacial Chemistry and Molecular Length on the Electronic Properties of Metal-Molecule-Silicon Junctions Produced by Flip Chip Lamination  , International Semiconductor Device Research Symposium   , College Park, MD, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=910382 (Accessed December 3, 2023)
Created December 15, 2011, Updated February 19, 2017