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iNEMI Project on Automotive Electronic Material Challenges



Yaw S. Obeng


Automobiles are incorporating more and more electronics from various industry sectors that have not been optimally designed for use inside the vehicle passenger compartment. Reliability and cost are two key considerations when incorporating traditional consumer electronics and military grade electronics for use in automotive applications. The drive for miniaturization coupled with automotive reliability expectations requires better understanding of material properties beyond standard bulk analysis. Long term reliability predictions require a basic understanding of how materials will fail under certain conditions. To date, the harsh automotive environmental conditions have not been translated to physical properties of material at the microscopic scale. Material failure physics is primarily only understood at the bulk level as opposed to performance at interfaces or other small geometrical structures used in automotive electronics. The opportunity in this project is to predict and understand functional performance of small geometries in harsh environments through measurement of material and interface properties. Conducting system level testing for every material and design can delay implementation and increase cost of new technologies, therefore a predictive methodology will be valuable to the industry. An iNEMI Automotive Materials project has been initiated to measure functional performance of small geometries through understanding a combination of material properties and interface properties. The end goal is to have the necessary information to predict reliability of technology to reduce design cycles. This would optimize reliability and reduce costs for the industry as a whole.
Proceedings Title
The 16th International Conference on Electronic Packaging Technology (ICEPT 2015)
Conference Dates
August 11-14, 2015
Conference Location


Automotive Electronics, Material, Interface, Reliability, Passager Compartment


Obeng, Y. (2015), iNEMI Project on Automotive Electronic Material Challenges, The 16th International Conference on Electronic Packaging Technology (ICEPT 2015), Changsha, -1, [online], (Accessed July 18, 2024)


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Created September 3, 2015, Updated November 10, 2018