High Sensitivity Technique for Measurement of Thin Film Out-of-Plane Expansion

Published

March 1, 1998

Author(s)

Chad R. Snyder, F I. Mopsik

Abstract

We have developed a technique utilizing a capacitance measurement for the accurate determination of the out-of-plane expansion of thin films on the order of 1 micrometer thick. This is important because the coefficient of thermal expansion (CTE) is a key parameter for the design and reliability of polymer containing products. Due to the drive towards denser packages and the use of thin polymeric films as inner-layer dielectrics (ILDs), a technique is required that can make precision measurements of the CTE of thin films. The current technique, thermomechanical analysis (TMA), has been demonstrated by a multi-user round-robin test to be inadequate for such measurements. The absolute measurement technique that we have developed is based upon a parallel plate three-terminal guarded electrode.

Proceedings Title

Characterization and Metrology for ULSI Technology: 1998 International Conference

Volume

449

Conference Dates

March 23-27, 1998

Conference Title

AIP Conference Proceedings

Pub Type

Conferences

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Keywords

absolute measurement, capacitance, coefficient of thermal expansion, swelling, thin film, z-axis expansion

Citation

Snyder, C. and Mopsik, F. (1998), High Sensitivity Technique for Measurement of Thin Film Out-of-Plane Expansion, Characterization and Metrology for ULSI Technology: 1998 International Conference, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=851423 (Accessed December 2, 2024)