Fully integrated multifunctional sensor and open-source ASIC for flexible wearables

Published

June 25, 2024

Author(s)

Anhang Li, Hongyi Wu, Ashbir Aviat Fadila, Chanho Kye, Arvind Balijepalli, Johan Euphrosine, Tim Ansell, Nigel Coburn, Sachin Nadig, Mehdi Saligane

Abstract

The open-source hardware movement has made significant progress over the past few years. Increasingly, more individuals are engaging with and participating in the open-source chip design community - not only to design their own chips with the available open-source tools, but to also have their designs physically fabricated and returned to them for practical use. Companies such as Google have sponsored such physical chip fabrication runs over the past few years as OpenMPW through semiconductor CMOS processes provided by both Skywater (SKY130) and Globalfoundries (GF180). Taken together, the access to open-source chip design tools, a growing supportive community, fabrication partners, financial sponsors, and a growing infrastructure of other suppliers and educators - a revolution in chip design is the logical end result. Leveraging existing resources provided by the open-source community, an Analog Front-End (AFE) Application Specific Integrated Circuit (ASIC) chip is submitted for tapeout in GF180 OpenPDK [Cite GF180]. The design includes two Operational Amplifiers (OPAMP), a Successive Approximation Register Analog Digital Converter (SAR ADC), and a switched-capacitor Digital Analog Converter (DAC) on the shuttle.

Citation

IEEE Solid-State Circuits Magazine

Pub Type

Others

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Keywords

Laser induced graphene (LIG), ASIC, CMOS, sensors

Citation

Li, A. , Wu, H. , Fadila, A. , Kye, C. , Balijepalli, A. , Euphrosine, J. , Ansell, T. , Coburn, N. , Nadig, S. and Saligane, M. (2024), Fully integrated multifunctional sensor and open-source ASIC for flexible wearables, IEEE Solid-State Circuits Magazine, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=957346 (Accessed December 9, 2024)