An Evaluation of Electrical Linewidth Determination Using Cross-Bridge and Multi-Bridge Test Structures

Published

December 31, 1999

Author(s)

Linda M. Head, Harry A. Schafft

Abstract

The Multi-Bridge method is often used in the industry to measure electrical linewidths of interconnect lines because it requires less sensitive equipment than the standard Cross-Bridge method. The method assumes that the linewidth process bias is independent of design width, which is shown here to be only approximately correct. This can result in linewidth determinations that are significantly different from the values obtained by the Cross-Bridge method. This is observed most often at the narrowest designed widths. A Composite method is proposed that minimizes these differences. The multi-bridge test structure can also be used to detect the linewidths at which chemical mechanical polishing (CMP) induces

Proceedings Title

1999 IIEEE International Integrated Reliability Workshop Final Report

Conference Dates

October 18-21, 1999

Conference Location

Lake Tahoe, CA, USA

Pub Type

Conferences

Keywords

dishing, linewidth, metrology, process control, reliability, sheet resistance, test structures

Citation

Head, L. and Schafft, H. (1999), An Evaluation of Electrical Linewidth Determination Using Cross-Bridge and Multi-Bridge Test Structures, 1999 IIEEE International Integrated Reliability Workshop Final Report, Lake Tahoe, CA, USA (Accessed October 15, 2025)