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An Evaluation of Electrical Linewidth Determination Using Cross-Bridge and Multi-Bridge Test Structures

Published

Author(s)

Linda M. Head, Harry A. Schafft

Abstract

The Multi-Bridge method is often used in the industry to measure electrical linewidths of interconnect lines because it requires less sensitive equipment than the standard Cross-Bridge method. The method assumes that the linewidth process bias is independent of design width, which is shown here to be only approximately correct. This can result in linewidth determinations that are significantly different from the values obtained by the Cross-Bridge method. This is observed most often at the narrowest designed widths. A Composite method is proposed that minimizes these differences. The multi-bridge test structure can also be used to detect the linewidths at which chemical mechanical polishing (CMP) induces
Proceedings Title
1999 IIEEE International Integrated Reliability Workshop Final Report
Conference Dates
October 18-21, 1999
Conference Location
Lake Tahoe, CA, USA

Keywords

dishing, linewidth, metrology, process control, reliability, sheet resistance, test structures

Citation

Head, L. and Schafft, H. (1999), An Evaluation of Electrical Linewidth Determination Using Cross-Bridge and Multi-Bridge Test Structures, 1999 IIEEE International Integrated Reliability Workshop Final Report, Lake Tahoe, CA, USA (Accessed July 16, 2024)

Issues

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Created December 30, 1999, Updated October 12, 2021