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Embedded multiconductor transmission line characterization

Published

Author(s)

Dylan F. Williams

Abstract

This paper presents a measurement method that characterizes lossy printed multiconductor transmission lies embedded in transitions, connectors, or packages with significant electrical parasitics. We test the method on a pair of lossy coupled asymmetric microstrip lies and compare to previous results.
Proceedings Title
IEEE MTT-S International Microwave Symposium Digest, 1997
Volume
3
Conference Dates
June 8-13, 1997
Conference Location
Denver, CO

Citation

Williams, D. (1997), Embedded multiconductor transmission line characterization, IEEE MTT-S International Microwave Symposium Digest, 1997, Denver, CO, [online], https://doi.org/10.1109/MWSYM.1997.596863 (Accessed June 14, 2024)

Issues

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Created June 8, 1997, Updated November 10, 2018