Williams, D.
(1997),
Embedded multiconductor transmission line characterization, IEEE MTT-S International Microwave Symposium Digest, 1997, Denver, CO, [online], https://doi.org/10.1109/MWSYM.1997.596863 (Accessed April 25, 2026)
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Embedded multiconductor transmission line characterization
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Abstract
This paper presents a measurement method that characterizes lossy printed multiconductor transmission lies embedded in transitions, connectors, or packages with significant electrical parasitics. We test the method on a pair of lossy coupled asymmetric microstrip lies and compare to previous results.Proceedings Title
IEEE MTT-S International Microwave Symposium Digest, 1997
Volume
3
Conference Dates
June 8-13, 1997
Conference Location
Denver, CO
Pub Type
Conferences
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Created June 8, 1997, Updated November 10, 2018