Electronics Interconnections for Extreme Environments
George G. Harman
This article discusses the requirements for wire-bond and flip-chip interconnections that can be used in packaging semiconductor devices for extreme high and low temperature environments [from +460 'C (HTE) down to -200 'C (LTE)]. Active devices capable of operating in these environments are needed for future space-probe operation on other solar system planets, deep-well-logging, geothermal measurements, sensors near rocket and jet engines, etc.
Advanced Packaging Magazine
Electronics Interconnections for Extreme Environments, Advanced Packaging Magazine
(Accessed May 30, 2023)