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Electronics Interconnections for Extreme Environments

Published

Author(s)

George G. Harman

Abstract

This article discusses the requirements for wire-bond and flip-chip interconnections that can be used in packaging semiconductor devices for extreme high and low temperature environments [from +460 'C (HTE) down to -200 'C (LTE)]. Active devices capable of operating in these environments are needed for future space-probe operation on other solar system planets, deep-well-logging, geothermal measurements, sensors near rocket and jet engines, etc.
Citation
Advanced Packaging Magazine

Citation

Harman, G. (2004), Electronics Interconnections for Extreme Environments, Advanced Packaging Magazine (Accessed May 20, 2024)

Issues

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Created February 1, 2004, Updated January 27, 2020