Harman, G.
(2004),
Electronics Interconnections for Extreme Environments, Advanced Packaging Magazine
(Accessed April 25, 2024)
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Electronics Interconnections for Extreme Environments
Published
Author(s)
Abstract
This article discusses the requirements for wire-bond and flip-chip interconnections that can be used in packaging semiconductor devices for extreme high and low temperature environments [from +460 'C (HTE) down to -200 'C (LTE)]. Active devices capable of operating in these environments are needed for future space-probe operation on other solar system planets, deep-well-logging, geothermal measurements, sensors near rocket and jet engines, etc.Citation
Advanced Packaging Magazine
Pub Type
Others
Citation
Created February 1, 2004, Updated January 27, 2020