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Dynamic Mechanical Analysis of the Glassy State Response of a Sub-Tg Annealed Model Epoxy Network

Published

Author(s)

Gale A. Holmes

Abstract

Using dynamic mechanical analyzers the relaxation behavior of a loosely cross-linked model epoxy resin was investigated before and after room temperature aging. Preliminary results indicate a stiffening of the storage moduli occurs below 50 C, the b relaxation temperature of the epoxy network, with a subsequent softening of the network above room temperature and a drop in the apparent glass transition temperature (Tg). of the material with aging.
Proceedings Title
ANTEC | | | Society of Plastics Engineers | 2007| ANTEC
Conference Dates
May 6-10, 2007
Conference Title
Annual Technical Conference (ANTEC?)

Keywords

dynamic mechanical analysis, epoxy, master curve, physical aging

Citation

Holmes, G. (2007), Dynamic Mechanical Analysis of the Glassy State Response of a Sub-Tg Annealed Model Epoxy Network, ANTEC | | | Society of Plastics Engineers | 2007| ANTEC, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852714 (Accessed February 27, 2024)
Created May 7, 2007, Updated February 17, 2017