NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.
Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.
An official website of the United States government
Here’s how you know
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Dynamic Mechanical Analysis of the Glassy State Response of a Sub-Tg Annealed Model Epoxy Network
Published
Author(s)
Gale A. Holmes
Abstract
Using dynamic mechanical analyzers the relaxation behavior of a loosely cross-linked model epoxy resin was investigated before and after room temperature aging. Preliminary results indicate a stiffening of the storage moduli occurs below 50 C, the b relaxation temperature of the epoxy network, with a subsequent softening of the network above room temperature and a drop in the apparent glass transition temperature (Tg). of the material with aging.
Proceedings Title
ANTEC | | | Society of Plastics Engineers | 2007| ANTEC
Holmes, G.
(2007),
Dynamic Mechanical Analysis of the Glassy State Response of a Sub-Tg Annealed Model Epoxy Network, ANTEC | | | Society of Plastics Engineers | 2007| ANTEC, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852714
(Accessed October 8, 2025)