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Dielectric Characterization of Embedded Decoupling Capacitance Films at Microwave Frequencies

Published

Author(s)

Jan Obrzut

Abstract

The dielectric permittivity and impedance characteristics were evaluated for high-dielectric constant polymer composite films, that are being developed by the industry for Embedded De-coupling Capacitance (EDC) applications. In order to extend the measurements to the microwave range, we developed a new testing methodology, in which the film specimen is treated as a distributed network consisting of a transmission line with the capacitance terminating a coaxial air-line. The theoretical model takes into consideration the wave propagation in the specimen section, thus eliminating limitations of the lumped element approximations. Using the new test technique, the dielectric permittivity of several EDC materials was evaluated at frequencies from 100 MHz to 10 GHz, and the impedance characteristics were determined directly in the time domain. The results obtained in the broad frequency range compared well with those obtained from the gap-coupled microstrip resonators at discrete frequencies. Based on the results, the desirable materials dielectric characteristics are discussed from the view point of designing efficient embedded de-coupling capacitance for high-speed circuits.
Proceedings Title
Proceedings of the SMTA 6th Annual New & Emerging Technologies for Electronic Packaging and Assembly
Volume
114(24)
Conference Dates
October 29-November 2, 2000
Conference Location
Dallas, TX
Conference Title
SMTA International Conference

Keywords

decoupling capacitance, dielectric permittivity, high dielectric constant films, microstrip resonator, microwave measurements, polymer composites, TDR

Citation

Obrzut, J. (2001), Dielectric Characterization of Embedded Decoupling Capacitance Films at Microwave Frequencies, Proceedings of the SMTA 6th Annual New & Emerging Technologies for Electronic Packaging and Assembly, Dallas, TX, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=851809 (Accessed June 19, 2024)

Issues

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Created January 1, 2001, Updated February 17, 2017