TY - CONF AU - Jan Obrzut C2 - Proceedings of the SMTA 6th Annual New & Emerging Technologies for Electronic Packaging and Assembly, Dallas, TX DA - 2001-01-01 LA - en M1 - 114(24) PB - Proceedings of the SMTA 6th Annual New & Emerging Technologies for Electronic Packaging and Assembly, Dallas, TX PY - 2001 TI - Dielectric Characterization of Embedded Decoupling Capacitance Films at Microwave Frequencies UR - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=851809 ER -