Harman, G.
(1997),
Critical Issues in Wire-Bonded Chip Interconnections to the Year 2001, Proc., Second Symposium on Electronic Packaging Technology, Shanghai, CH
(Accessed September 8, 2024)
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Critical Issues in Wire-Bonded Chip Interconnections to the Year 2001
Published
Author(s)
Proceedings Title
Proc., Second Symposium on Electronic Packaging Technology
Conference Dates
December 9-12, 1996
Conference Location
Shanghai, CH
Pub Type
Conferences
Citation
Issues
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Created December 31, 1997, Updated February 17, 2017