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Critical Issues in Wire-Bonded Chip Interconnections to the Year 2001

Published

Author(s)

George G. Harman
Proceedings Title
Proc., Second Symposium on Electronic Packaging Technology
Conference Dates
December 9-12, 1996
Conference Location
Shanghai, CH

Citation

Harman, G. (1997), Critical Issues in Wire-Bonded Chip Interconnections to the Year 2001, Proc., Second Symposium on Electronic Packaging Technology, Shanghai, CH (Accessed May 28, 2024)

Issues

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Created December 31, 1997, Updated February 17, 2017