Harman, G.
(1997),
Critical Issues in Wire-Bonded Chip Interconnections to the Year 2001, Proc., Second Symposium on Electronic Packaging Technology, Shanghai, CH (Accessed October 5, 2026)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Critical Issues in Wire-Bonded Chip Interconnections to the Year 2001
Published
Author(s)
Proceedings Title
Proc., Second Symposium on Electronic Packaging Technology
Conference Dates
December 9-12, 1996
Conference Location
Shanghai, CH
Pub Type
Conferences
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact [email protected].
Created December 31, 1997, Updated February 17, 2017