Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Creep of Thin Film Au on Bimaterial Au/Si Microcantilevers

Published

Author(s)

Dudley Finch

Abstract

We examine creep in thin film Au to bimaterial Au/Si microcantilevers. Due to thermal expansion coefficient mismatch between the Au and Si layers, the microcantilevers show considerable out-of-pane curvatoure when subjected to a change over time. Curvature-temperature-time experiments are used to examine the effects of hold temperature and maximum annealing temperature on the inelatic response of Au films. Experiments reveal three distinct inelastic strains in the Au films-creep, recovery, and microstructural coarsening. At moderate hold temperatures 30oC
Citation
Acta Materialia

Keywords

Bimaterials, cantilever, creep, curvature, finite elecment analysis, gold, mems, thin fims

Citation

Finch, D. (2008), Creep of Thin Film Au on Bimaterial Au/Si Microcantilevers, Acta Materialia (Accessed July 24, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created October 16, 2008