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Creep of Thin Film Au on Bimaterial Au/Si Microcantilevers



Dudley Finch


We examine creep in thin film Au to bimaterial Au/Si microcantilevers. Due to thermal expansion coefficient mismatch between the Au and Si layers, the microcantilevers show considerable out-of-pane curvatoure when subjected to a change over time. Curvature-temperature-time experiments are used to examine the effects of hold temperature and maximum annealing temperature on the inelatic response of Au films. Experiments reveal three distinct inelastic strains in the Au films-creep, recovery, and microstructural coarsening. At moderate hold temperatures 30oC
Acta Materialia


Bimaterials, cantilever, creep, curvature, finite elecment analysis, gold, mems, thin fims


Finch, D. (2008), Creep of Thin Film Au on Bimaterial Au/Si Microcantilevers, Acta Materialia (Accessed July 24, 2024)


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Created October 16, 2008