We have employed finite element analysis to develop computational Seebeck coefficient metrology simulations. This approach enables a unique exploration of multiple probe arrangements and measurement techniques within the same temporal domain. To demonstrate the usefulness of this approach, we have performed these Seebeck coefficient measurement simulations to quantitatively explore perturbations to the voltage and temperature correspondence, by comparing simultaneous and dynamic data acquisition techniques under the quasi-steady-state condition. The results indicate significant distortions to the Seebeck coefficient and a strong dependence on the time delay, the acquisition sequence, and the probe arrangement.
Citation: Journal of Research (NIST JRES) - 117.009Report Number:
NIST Pub Series: Journal of Research (NIST JRES)
Pub Type: NIST Pubs
thermoelectric, Seebeck coefficient, metrology, finite element analysis, computational simulations