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Combinatorial Library Designs for Quantifying Thin Film Adhesion via the Edge Delamination Test



Jae H. Kim, Martin Chiang, D Kawaguchi, Naomi Eidelman, Christopher Stafford, Chang K. Moon


In this paper, we demonstrate a combinatorial thin film library design for investigating the adhesion between film and substrate as measured by the edge delamination test. This library design allows rapid screening of critical parameter spaces that controls thin film reliability and bond strength in films and coatings. Specifically, our library design was aimed at quantifying the effect of thickness and temperature on the interfacial integrity of a film to an underlying substrate.To create the combinatorial library, a single specimen was fabricated having a thickness gradient of an epoxy film on a glass or silicon substrate, After dicing the film into individual squares but still contained on a single substrate, a temperature gradient is applied orthogonal to the thickness gradient to induce debonding events where the adhesion is below a critical value. The results demonstrate that our combinatorial library design and approach provides a large parameter space for accurately and reproducibly mapping the interfacial integrity and bond strength of a thin film to a substrate.
Journal of Physics D-Applied Physics


adhesion, coatings, combinatorial approach, fracture, glass, polymer, thin film


Kim, J. , Chiang, M. , Kawaguchi, D. , Eidelman, N. , Stafford, C. and Moon, C. (2010), Combinatorial Library Designs for Quantifying Thin Film Adhesion via the Edge Delamination Test, Journal of Physics D-Applied Physics, [online], (Accessed June 24, 2024)


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Created December 21, 2010, Updated October 12, 2021