Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Chapter 2: Fundamental Properties of PB-Free Solder Alloys Affecting Manufacturing, Performance and Reliability

Published

Author(s)

C A. Handwerker, Ursula R. Kattner, Kil-Won Moon

Abstract

The search for a global Pb-free replacement for Pb-Sn eutectic alloy has been an evolving process as the threat of a regional lead ban became a reality in July, 2006. Over the twelve years from 1994 through 2006, the manufacturing, performance, and reliability criteria for Pb-free solder joints have become increasingly complex as relationships between the solder alloy, the circuit board materials and construction, and the component designs and materials have been revealed through widespread experimentation by companies, industrial consortia, and university researchers. The focus of this chapter is to examine the primary criteria used to develop the current generation of Pb-free solder alloys, the tradeoffs made between various properties once these primary criteria were satisfied, and the open questions regarding materials and processes that are as yet unanswered.
Citation
Chapter 2: Fundamental Properties of PB-Free Solder Alloys Affecting Manufacturing, Performance and Reliability
Publisher Info
Book Chapter Pb-Free Soldering, Editor: Jasbir Bath | Publisher: Springer,

Keywords

alloy design, lead-free, microstructure, solder, solidification

Citation

Handwerker, C. , Kattner, U. and Moon, K. (2008), Chapter 2: Fundamental Properties of PB-Free Solder Alloys Affecting Manufacturing, Performance and Reliability, Book Chapter Pb-Free Soldering, Editor: Jasbir Bath | Publisher: Springer, (Accessed March 2, 2024)
Created October 16, 2008