Bottom-up Electrodeposition of Zinc in Through Silicon Vias Using Breakdown of Additive-Derived Suppression

Published

January 12, 2015

Author(s)

Daniel Josell, Thomas P. Moffat

Abstract

This paper presents superconformal feature filling during zinc electrodeposition in a sulfate electrolyte. Localized bottom-up filling of Through Silicon Vias (TSVs) with no deposition on the sidewalls or the field around them is presented in electrolytes containing a deposition rate suppressing additive. This behavior is observed for deposition at applied potentials near that where suppression breakdown and localized zinc deposition are observed in electroanalytical measurements with planar rotating disk electrodes. With this demonstration, zinc becomes the third metal for which highly localized, bottom-up filling of TSV-size features has been demonstrated. It is also the first non-cubic metal superconformally deposited into patterned features. The TSV filling and electroanalytical measurements are discussed in the context of existing models for superconformal electrodeposition.

Citation

Journal of the Electrochemical Society

Pub Type

Journals

Citation

Josell, D. and Moffat, T. (2015), Bottom-up Electrodeposition of Zinc in Through Silicon Vias Using Breakdown of Additive-Derived Suppression, Journal of the Electrochemical Society (Accessed June 6, 2023)