Skip to main content

NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Bonded Wafers for Three-Dimensional Integration

Published

Author(s)

Richard A. Allen

Abstract

Three-dimensional (3D) integration is a key enabling technology for compact, high-performance, and/or low-power electronics. This technology enables the fabrication of circuits with functions that commonly cannot be fabricated on a single substrate in a smaller 3D footprint, a key consideration in portable and wearable devices, or can enable higher density of transistors in a 3D footprint, a key consideration in high-performance computing. 3D stacking, in turn, is enabled by wafer bonding, whereby two or more wafers are bonded into a single “device”, which can then be inserted into a system.
Citation
SEMI Standards Watch

Keywords

there-dimesional stacked integrated circuits (3DS-IC), packaging, integrated circuits

Citation

Allen, R. (2017), Bonded Wafers for Three-Dimensional Integration, SEMI Standards Watch, [online], http://www.semi.org/en/node/120011?utm_source=hs_email&utm_medium=email&utm_content=43758623&_hsenc=p2ANqtz-_c81n0SMz3VgUwguZfM_gPwa8ObHwxmCNfXfXWTAgUnTOREQFBbhMpKj5KOFjHSWv_Chof_pkqpKiViAWjfGBE1kYnHA&_hsmi=43758623 (Accessed October 2, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created March 2, 2017, Updated October 5, 2017
Was this page helpful?