Radio frequency (RF), high frequency (HF), and analog/mixed-signal (AMS) technologies serve the rapidly growing communications markets that include many of the physical components for the Internet of Everything (IoE) (e.g., http://www.cisco.com/web/about/ac79/innov/IoE.html
) and represent essential and critical technologies for the success of many semiconductor manufacturers. Communications products and emerging products with functionalities enabled by more-than- Moore (MtM) RF, HF, and AMS technologies are becoming key drivers for volume manufacturing. Consumer products account for over half of the demand for semiconductors. Fourth generation (4G) cellular phones and tablets now have a much higher RF and AMS semiconductor content and now are a very large fraction of the mobile market compared to only 5 % of the market a few years ago. The iPAD for example has more than 19 RF and AMS front-end components. The consumer portions of the RF and AMS markets are very sensitive to cost. With different technologies capable of meeting technical requirements, time to market and overall system cost will govern technology selection. As compared with the scope of the 2013 RF and AMS International Technology Roadmap for Semiconductors (ITRS), the scope for the 2014 Update includes both wireless and tethered technologies based on: 1. RF Complementary Metal Oxides Semiconductor (CMOS) 2. Group IV Silicon Bipolar and BiCMOS 3. mm-Wave Groups IV and III-V Compound Semiconductors The requirements for transceiver ICs are technology drivers that contribute substantially to the recent ITRS-defined More-than- Moore (MtM) thrust. This 2014 ITRS RF and AMS Chapter Update is divided into the four analog-carrier frequency bands low frequency (LF) 0.0 GHz 0.4 GHz, radio frequency (RF) 0.4 GHz 30 GHz, millimeter-wave (mm-wave) 30 GHz 300 GHz, and terahertz (THz) greater than 300 GHz. Figure 1 lists a few examples of applications for each of these bands.