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Thomas P. Moffat

Research Interests include:

  • Electrochemical processing for advanced metallization in microelectronics
  • Magnetic devices
  • Synthesis of alloy electrocatalyst

Dr. Moffat is a member of the Functional Nanostructured Materials Group in the Materials Science and Engineering Division at National Institute of Standards and Technology (NIST). He received B.E. and M.Sc. degrees from Vanderbilt University in 1982 and 1984, respectively and an Sc.D. degree in materials science and engineering from the Massachusetts Institute of Technology in 1989. He then spent two years as a postdoctoral associate in A.J. Bard's laboratory at the University of Texas, Austin. Dr. Moffat joined NIST in 1991 to study thin film deposition processes. In 2001 he received the Gold Medal of the U.S. Department of Commerce for his work in the area of superconformal film growth. He is also the recipient of the 2006 Research Award of the Electrodeposition Division of The Electrochemical Society. He is an author or coauthor of more than 100 technical papers. Dr. Moffat is an active member of the Electrochemical Society, the International Society of Electrochemistry, the Materials Research Society and the American Association for the Advancement of Science. He will Chair the 2008 Gordon Research Conference on Electrodeposition. Currently he is exploring the use of electrochemical processing for advanced metallization in microelectronics, magnetic devices, and the synthesis of alloy electrocatalyst.


Simulation of Copper Electrodeposition in Through-Hole Vias

Trevor M. Braun, Daniel Josell, Thomas P. Moffat, Jimmy John
Copper electrodeposition processes for filling metallized through-hole (TH) and through-silicon vias (TSV) depend on selective breakdown of a co-adsorbed

Accelerated Bottom-up Gold Filling of Trenches

Daniel Josell, Maureen E. Williams, Stephen J. Ambrozik, Chen Zhang, Thomas P. Moffat
This work extends previously detailed void-free, bottom-up feature filling in a near-neutral Na3Au(SO3)2 + Na2SO3 electrolyte containing micromolar
Created October 9, 2019