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Thomas P. Moffat (Fed)

Research Interests include:

  • Electrochemical processing for advanced metallization in microelectronics
  • Magnetic devices
  • Synthesis of alloy electrocatalyst

Dr. Moffat is a member of the Functional Nanostructured Materials Group in the Materials Science and Engineering Division at National Institute of Standards and Technology (NIST). He received B.E. and M.Sc. degrees from Vanderbilt University in 1982 and 1984, respectively and an Sc.D. degree in materials science and engineering from the Massachusetts Institute of Technology in 1989. He then spent two years as a postdoctoral associate in A.J. Bard's laboratory at the University of Texas, Austin. Dr. Moffat joined NIST in 1991 to study thin film deposition processes. In 2001 he received the Gold Medal of the U.S. Department of Commerce for his work in the area of superconformal film growth. He is also the recipient of the 2006 Research Award of the Electrodeposition Division of The Electrochemical Society. He is an author or coauthor of more than 100 technical papers. Dr. Moffat is an active member of the Electrochemical Society, the International Society of Electrochemistry, the Materials Research Society and the American Association for the Advancement of Science. He will Chair the 2008 Gordon Research Conference on Electrodeposition. Currently he is exploring the use of electrochemical processing for advanced metallization in microelectronics, magnetic devices, and the synthesis of alloy electrocatalyst.


Artifacts That Could Be Misinterpreted as Ballistic Magnetoresistance

William F. Egelhoff Jr., L Gan, Erik B. Svedberg, Cedric J. Powell, Alexander J. Shapiro, Robert McMichael, J Mallett, Thomas P. Moffat, Mark D. Stiles
Theoretical physics suggests that very large magnetoresistance (MR) values might be found in certain magnetic nanocontacts if a magnetic domain wall could be


Process for Forming a Transition Zone Terminated Superconformal Filling

NIST Inventors
Daniel Josell and Thomas P. Moffat
Patent Description This invention is an electrodeposition process that permits nickel filling of features such as pinholes in metal tubing. The process uses a deposition rate suppressing additive (“suppressor” that yields “critical behavior” such that deposition occurs at more negative potentials (
Created October 9, 2019, Updated June 30, 2022