Hysteretic current-voltage mediated void-free superconformal and bottom-up filling of recessed features includes providing an electrodeposition composition with a hysteretic cyclic voltammogram; providing the substrate controlling applied electric potential; autonomously reducing the deposition potential of the recess; bifurcating the recess; forming a transition zone and moving the transition zone through the metal deposition; and reducing metal ions to form metal; and forming a resistance enhanced superconformal filling in the recess from the metal, such that forming the resistance enhanced superconformal filling occurs in consequence of autonomously reducing the deposition potential of the recess.