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Tammy Lucas (Fed)

Tammy Lucas is a Chemical Engineer in the Quantum Sensors Group within the Quantum Electromagnetics Division at NIST where she conducts research on the novel nano/micro-fabrication of ultra-low temperature superconducting sensors and circuits with the focus on cosmology and high-energy astrophysics detectors. She holds several US patents related to cadmium telluride thin film solar and has authored/coauthored multiple peer reviewed conference and journal articles.

RECENT PUBLICATIONS

  • T.J. Lucas et al., “Indium Bump Process for Low-Temperature Detectors and Readout.” Journal of Low Temperature Physics, 2022-05-20, Journal article, DOI: 10.1007/s10909-022-02728-6
  • Zhilei Xu et al., “The Simons Observatory: The Large Aperture Telescope (LAT).” Research Notes of the AAS 5 (4), 100

AWARDED US PATENTS

  • 8,338,698 – Anisotropic conductive layer as a back contact in thin film photovoltaic devices
  • 8,187,912 – Methods of forming an anisotropic conductive layer as a back contact in thin film photovoltaic devices
  • 9,159,864 – Back contact paste with Te enrichment and copper doping control in thin film photovoltaic devices
  • 9,117,956 – Method of controlling the amount of Cu doping when forming a back contact of a photovoltaic cell

Publications

Symmetric time-division-multiplexed SQUID readout with two-layer switches for future TES observatories

Author(s)
Malcolm Durkin, Scott Backhaus, Simon Bandler, James Chervenak, Ed Denison, W.Bertrand (Randy) Doriese, Johnathon Gard, Gene C. Hilton, Richard Lew, Tammy Lucas, Carl D. Reintsema, Dan Schmidt, Stephen Smith, Joel Ullom, Leila R. Vale, Michael Vissers, Nicholas Wakeham
Time-division multiplexing (TDM) of transition-edge-sensor (TES) microcalorimeters is being developed as the readout tech-nology for the Athena X-ray integral

Indium Bump Process for Low-Temperature Detectors and Readout

Author(s)
Tammy Lucas, John Biesecker, W.Bertrand (Randy) Doriese, Shannon Duff, Gene C. Hilton, Joel Ullom, Michael Vissers, Dan Schmidt
We describe our indium bump process for low-temperature detectors and associated readout. A titanium nitride under bump metallization layer (UBM) is reactively
Created September 21, 2019, Updated October 11, 2023